Materials used in FPC circuit board

1. Raw materials  

(1) glue material, no glue material;  The copper on the material is divided into electrolytic copper and calendered copper. The material of non-adhesive calendered copper is flexible and has good foldability.  

(2) Material thickness: PI+ copper thickness  

2, covering film  

The covering film is composed of PI and glue.  

3, reinforcement  

Reinforcement generally has the following kinds;  PI reinforcement, PED reinforcement, FR4 reinforcement, steel sheet reinforcement, etc. Generally, the thickness of reinforcement includes PI1/2, 1/2, PI11, PI21, PI31 to PI91. The two values after PI respectively represent the thickness of PI and the thickness of glue, and the unit is Mil.  Thickness according to customer requirements.  

4, pure rubber  

Pure adhesive is mainly used for lamination and lamination of multilayer boards, but also for bonding reinforcement.  

5, the membrane closure  

Mainly play a signal screen closed function, and to ground.  

6, 3 M adhesive  

Bonding reinforcement and fixation FPC and other functions