FPC soft plate surface plating needs to pay attention to what problems

1, flexible circuit board plating  

The surface of the exposed copper conductor may be contaminated by adhesives or ink after the process of covering layer at the beginning and end of FPC electroplating, and there may also be oxidation and discoloration due to high temperature process. In order to obtain a close coating with good adhesion, the pollution and oxidation layer on the conductor surface must be removed to make the conductor surface clean.  

But some of these pollution and copper conductor fusion is very stable, with weak washing agent cannot completely remove, so that most tend to have a certain strength, alkaline abrasives and brush and used for processing, most of the mask layer adhesives is a kind of epoxy resin and alkali resistant function is poor, so can cause bonding strength, though not clearly visible, but in FPC electroplating process,  The plating solution is likely to permeate from the edge of the cover layer, when it matters, the cover layer is stripped.  During the final welding, solder is drilled into the cover layer.  

2. Flexible circuit board electroless plating  

Electroless plating is necessary when the conductor of the line to be electroplated is helpless and cannot be used as an electrode.  Usually electroless plating bath has a violent chemical action, such as chemical gold-plating process is a typical example.  Chemical gold-plating solution is an alkaline aqueous solution with a very high pH value.  When using this plating process, it is very easy to drill the plating solution under the cover layer, especially if the cover film laminating process quality treatment is not strict, low bonding strength, more simple to occur this problem.  

Due to the characteristics of the plating solution, it is easier for the plating solution to drill into the cover layer, and it is difficult to obtain the desired plating conditions by using this process.  

3. Hot air leveling of flexible circuit board  

Hot air leveling was originally developed for coating rigid printed board PCB with lead and tin. Due to its simplicity, it is also used in flexible printed board FPC.  Hot air leveling is the plate directly vertical immersion in molten tin tank, excess solder with hot air blowing.  This condition for FPC flexible printed circuit board is very sharp, if the flexible PCB FPC don't use any countermeasure can't immersed in the solder, must have flexible PCB FPC sandwiched between titanium and steel wire mesh, again into the molten solder, in advance, of course, also want to clean the surface of the flexible PCB FPC processing and coating flux.