Meizhou FPC soft light board requirements

Advantages of FPC board :a. Heat dissipation is significantly better than the standard FR-4 structure.  B. The dielectric used is usually 5 to 10 times the thermal conductivity of conventional epoxy glass and 1/10 of the thickness.  C. Heat transfer index is more efficient than traditional rigid PCBS.  D. You may use copper weights lower than those shown on IPC recommended charts.  1. Audio equipment: input amplifier, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc.  Power supply equipment: switching voltage regulator, DC/AC converter, SW voltage regulator, etc.  FPC soft lamp board aluminum base plate technical requirements, so far, there is no international aluminum base copper clad plate standard.  Our country by 704 factory is responsible for drafting the electronic industry military standard "flame retardant aluminum base copper clad laminate specification" FPC board soft light board  

Aluminum substrate structure :1.FPC line layer, line layer (generally using electrolytic copper foil) through etching to form printed circuit, used to achieve device assembly and connection.  With the same thickness and the same line width, the aluminum substrate can carry a higher current than the traditional FR-4.  2. Insulation layer: insulation layer is the core technology of aluminum substrate, mainly playing the function of bonding, insulation and heat conduction.  Aluminum substrate insulation layer is the largest thermal barrier in power module structure.  The better the thermal conductivity of the insulation layer is, the more conducive to the diffusion of heat generated during the operation of the device, and the more conducive to the reduction of the operating temperature of the device, so as to improve the power load of the module, reduce the volume, prolong the life, improve the power output and other purposes.  The main technical requirements are: size requirements, including board size and deviation.  Thickness and deviation. Verticality and warpage: appearance.  Including cracks. Scratches.  Requirements for burrs and delamination. Aluminum oxide film;  Performance, including peel strength.  Surface resistivity. Low breakdown voltage.  Dielectric constant, flammability and thermal resistance, etc.  Compared with the two in terms of heat dissipation, the performance of aluminum substrate in heat dissipation is more superior to that of PCB board, and its thermal conductivity is also different. Aluminum substrate is a kind of PCB, and the price of aluminum substrate is compared.  Aluminum substrates shall not be perforated.  The coefficient of thermal conductivity of aluminum plate is aluminum plate quality evaluation is an important indicator of one of the other two most important factors are aluminum plate thermal resistance and withstand voltage value of the aluminum plate, aluminum plate in the market now generally coefficient of thermal conductivity is 2.00.1 commonly, for the coefficient of thermal conductivity of aluminum plate concrete can be measured by instruments,  The thermal conductivity of aluminum substrate will directly affect the price of aluminum substrate. In general, the higher the thermal conductivity of aluminum substrate, the higher the price of aluminum substrate will be.  

Advantages of aluminum PCB :a. Heat dissipation is significantly better than standard FR-4 structure.  B. The dielectric used is usually 5 to 10 times the thermal conductivity of conventional epoxy glass and 1/10 of the thickness.  C. Heat transfer index is more efficient than traditional rigid PCBS.  D. You may use copper weights lower than those shown on IPC recommended charts.  1. Audio equipment: input amplifier, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc.  Power supply equipment: switching voltage regulator, DC/AC converter, SW voltage regulator, etc.  FPC soft lamp board aluminum base plate technical requirements, so far, there is no international aluminum base copper clad plate standard.  Our country by 704 factory is responsible for drafting the electronic industry military standard "flame retardant aluminum base copper clad laminate specification" FPC soft light board  

Aluminum substrate structure :1.FPC board circuit layer, circuit layer (generally using electrolytic copper foil) through etching to form printed circuit, used to achieve device assembly and connection.  With the same thickness and the same line width, the aluminum substrate can carry a higher current than the traditional FR-4.  2. Insulation layer: insulation layer is the core technology of aluminum substrate, mainly playing the function of bonding, insulation and heat conduction.  Aluminum substrate insulation layer is the largest thermal barrier in power module structure.  The better the thermal conductivity of the insulation layer is, the more conducive to the diffusion of heat generated during the operation of the device, and the more conducive to the reduction of the operating temperature of the device, so as to improve the power load of the module, reduce the volume, prolong the life, improve the power output and other purposes.  The main technical requirements are: size requirements, including board size and deviation.  Thickness and deviation. Verticality and warpage: appearance.  Including cracks. Scratches.  Requirements for burrs and delamination. Aluminum oxide film;  Performance, including peel strength.  Surface resistivity. Low breakdown voltage.  Dielectric constant, flammability and thermal resistance, etc.  Compared with the two in terms of heat dissipation, the performance of aluminum substrate in heat dissipation is more superior to that of PCB board, and its thermal conductivity is also different. Aluminum substrate is a kind of PCB, and the price of aluminum substrate is compared.  Aluminum substrates shall not be perforated.  The coefficient of thermal conductivity of aluminum plate is aluminum plate quality evaluation is an important indicator of one of the other two most important factors are aluminum plate thermal resistance and withstand voltage value of the aluminum plate, aluminum plate in the market now generally coefficient of thermal conductivity is 2.00.1 commonly, for the coefficient of thermal conductivity of aluminum plate concrete can be measured by instruments,  The thermal conductivity of aluminum substrate will directly affect the price of aluminum substrate. In general, the higher the thermal conductivity of aluminum substrate, the higher the price of aluminum substrate will be.  

2. Use tweezers to carefully place the PQFP chip on the PCB, taking care not to damage the pins.  Align it with the pad, ensuring that the chip is placed in the correct direction.  Adjust the temperature of the soldering iron to more than 300 degrees Celsius circuit board working principle: is the use of plate insulation material separated from the surface of the copper foil conductive layer, so that the current along the pre-designed route in the various components of the flow to complete such as work.  Amplification. Attenuation. Modulation.  Demodulation. Coding and other functions.  On a basic PCB, the parts are concentrated on one side and the wires are concentrated on the other.  Because the wires only appear on one side, the PCB is called a single panel.  A multilayer board, with multiple layers of wires, requires a proper circuit connection between the two layers, and the bridge between the circuits is called the guide hole (VIA).  The basic circuit board design process can be divided into the following four steps: dip the tip of the soldering iron into a small amount of solder, press the tool down on the aligned chip, add a small amount of flux to the two diagonal pins, still press the chip down, weld the two diagonal pins so that the chip is fixed and cannot move.  Recheck chip alignment after soldering diagonal.  If necessary, it can be adjusted or removed and re-aligned on the PCB.  

5.EIM electromagnetic film - affixed to the surface of FPC, used for shielding signal interference;  EIM electromagnetic film is A method by vacuum sputtering, can be coated on different substrates (PET/PC/ glass, etc.) shielding material, EMI electromagnetic interference shielding with very low resistance FPC soft lamp board glass fiber board and aluminum substrate PCB there are three differences :A.  In terms of price, the important components of LED fluorescent tubes are: circuit board,LED chip and drive power supply.  Common circuit boards come in two types: aluminum and fiberglass.  Comparing the price of fiberglass with that of aluminum, fiberglass will be much cheaper, but the performance of aluminum will be better than fiberglass.  B. Technology: According to different materials and manufacturing process, fiberglass can be divided into three types: double-sided copper foil fiberglass, perforated copper foil fiberglass and single-sided copper foil fiberglass.  Of course, the price of fiberglass panels made of different materials will vary.  Fiberglass panels are made of different materials and technologies at different prices.  LED fluorescent tubes and fiberglass do not dissipate heat as well as LED fluorescent tubes with aluminum-based panels.  6. Conductive adhesive - used for bonding of steel sheet and FPC to conduct electricity.  Can realize the function of steel grounding;  Conductive adhesive is a kind of adhesive with certain electrical conductivity after curing or drying.  Mainly made of resin matrix.  Conducting particles and dispersing additives.  Auxiliaries and other components.  It can connect a variety of conductive materials together to form an electrical path between the connected materials.  In the electronics industry, conductive adhesive has become an indispensable new material.  2. Carefully place the PQFP chip on the PCB with tweezers, taking care not to damage the pins.  Align it with the pad, ensuring that the chip is placed in the correct direction.  Adjust the temperature of the soldering iron to more than 300 degrees Celsius circuit board working principle: is the use of plate insulation material separated from the surface of the copper foil conductive layer, so that the current along the pre-designed route in the various components of the flow to complete such as work.  Amplification. Attenuation. Modulation.  Demodulation. Coding and other functions.  On a basic PCB, the parts are concentrated on one side and the wires are concentrated on the other.  Because the wires only appear on one side, the PCB is called a single panel.  A multilayer board, with multiple layers of wires, requires a proper circuit connection between the two layers, and the bridge between the circuits is called the guide hole (VIA).  The basic circuit board design process can be divided into the following four steps: dip the tip of the soldering iron into a small amount of solder, press the tool down on the aligned chip, add a small amount of flux to the two diagonal pins, still press the chip down, weld the two diagonal pins so that the chip is fixed and cannot move.  Recheck chip alignment after soldering diagonal.  If necessary, it can be adjusted or removed and re-aligned on the PCB.  

EIM electromagnetic film - affixed to the surface of the flexible circuit board, used to shield signal interference;  EIM electromagnetic film is a method by vacuum sputtering, can be in different substrate (PET/PC/ glass, etc.) on the shielding material, with very low resistance to achieve EMI electromagnetic interference shielding FPC soft lamp board glass fiber board and aluminum substrate PCB