Huizhou FPC flexible circuit board manufacturers direct sales

Classification of FPC flexible circuit board: FPC flexible circuit board is divided into three categories: one is the general flexible circuit board FPC, the insulation layer is composed of epoxy glass cloth bonding sheet; The second is the high heat dissipation flexible circuit board FPC, the insulation layer is made of high thermal conductivity epoxy resin or other resin; The third is FPC flexible circuit board for high frequency circuit, and the insulating layer is composed of polyolefin resin or polyimide resin glass cloth bonded sheet. Aluminum base copper clad plate and conventional FR-4 copper clad plate is a big difference in heat dissipation, compared with 1.5mm thickness OF FR-4 copper clad plate and aluminum base copper clad plate, the former thermal resistance 20~22, the latter thermal resistance 1.0~2.0, the latter is much smaller.

Flexible circuit board FPC. Performance: It is well known that aluminum substrate has good heat dissipation performance, its heat dissipation performance is far better than glass fiber board. Because aluminum substrate has good thermal conductivity, flexible CIRCUIT board FPC plays an important role in LED lamp field. Aluminum substrate by its own structure, has the following characteristics: very good thermal conductivity, single bound copper, the device can only be placed in the bound copper surface, can not open the electrical connection hole so can not be placed in accordance with the single panel jumper. Circuit board (PCB) alias: circuit board, PCB board, aluminum substrate, HF board, ultra-thin circuit board, ultra-thin circuit board, printing (copper etching technology) circuit board and so on. Because of the current electronic products are constantly small with fine, circuit board can make circuit miniaturization, intuitive, for the batch production of fixed circuit and optimization of electrical layout plays an important role, so the application is more and more widely.

Use tweezers to carefully place the PQFP chip on the PCB, taking care not to damage the pins. Align it with the pad, ensuring that the chip is placed in the correct direction. Circuit board: A printed board on an insulating substrate that is designed to connect wires from point to point, but has no printed elements. Circuit board: A printed board on an insulating substrate formed to a predetermined design to connect wires from point to point and to print components. Generally speaking, the circuit board is already equipped with various components of the board, and the circuit board is not equipped with components, just a good design of the substrate. There is no difference between a circuit board and a circuit board, essentially the same. , dip the tip of the soldering iron into a small amount of solder, press down the chip in the aligned position with the tool, add a small amount of flux to the pins in the two diagonal positions, still press down the chip, weld the pins in the two diagonal positions, so that the chip is fixed but not moved. Recheck chip alignment after soldering diagonal. If necessary, it can be adjusted or removed and re-aligned on the PCB.

Audio equipment: input amplifier, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc. 2. Power supply equipment: switch regulator, DC/AC converter, SW regulator and other flexible circuit board FPC in terms of heat dissipation comparison, aluminum substrate in terms of heat dissipation performance is more superior to PCB board, its thermal conductivity is not the same aluminum substrate is a KIND of PCB, the price of aluminum substrate is more expensive. Aluminum substrates shall not be perforated. The coefficient of thermal conductivity of aluminum plate is aluminum plate quality evaluation is an important indicator of one of the other two most important factors are aluminum plate thermal resistance and withstand voltage value of the aluminum plate, aluminum plate in the market now generally coefficient of thermal conductivity is 2.00.1 commonly, for the coefficient of thermal conductivity of aluminum plate concrete can be measured by instruments, The e level of thermal conductivity of aluminum substrate will directly affect the price of aluminum substrate, in general, the higher the thermal conductivity of aluminum substrate is relatively higher the price of aluminum substrate. 3. Communication electronic equipment: high frequency amplifiers, filter appliances, transmitting circuits. 4. Office automation equipment: motor drivers, etc. 5. Automobile: electronic regulator, igniter, power controller, etc. 6. Computer: CPU board, floppy disk drive, power supply unit, etc.